Sikaflex AT Connection, Elastic Joint Sealant Moisture Curing, Interior & Exterior, 600 mL
SIKA
Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.
Read more| Sikaflex AT Connection is a 1-component, moisture-curing, elastic joint sealant.
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UsageSikaflex AT Connection is designed for connection joints between porous and non-porous substrates such as windows and/or doors and other building parts.Advantages
Packaging600 ml foil pack, 20 foil packs per box ColourGrey and white | ||||||||||||||||||||||||||||||||
Technical Information Shore A Hardness ~24 (after 28 days) (ISO 868) Secant Tensile Modulus ~0.40 N/mm2 at 100% elongation (23 °C) (ISO 8339) Elastic Recovery ~70% (ISO 37) Tear Propagation Resistance ~4.5 N/mm (ISO 34) Movement Capability ± 25% (ISO 9047) Resistance to Weathering 8 (ISO / DIS 19862) Service Temperature −40 °C to +90 °C Joint Design The joint width must be designed to suit the movement capability of the sealant. The joint width shall be ≥ 10 mm and ≤ 35 mm. A width to depth ratio of 2:1 must be maintained. Min. joint width [mm] Min. joint depth [mm] All joints must be correctly designed and dimensioned in accordance with the relevant standards, before their construction. The basis for calculation of the necessary joint widths are the type of structure and its dimensions, the technical values of the adjacent building materials and the joint sealing material, as well as the specific exposure of the building and the joints. For larger joints please contact our Technical Service Department. | ||||||||||||||||||||||||||||||||
Application Information Backing Material Use closed cell, polyethylene foam backing rods. Sag Flow
Ambient Air Temperature +5 °C to +40 °C Substrate Temperature +5 °C to +40 °C, min. 3 °C above dew point temperature Curing Rate
Skin Time
Tooling Time
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