Sikadur-30, 2-Part Epoxy Structural Adhesive, Interior & Exterior, Light Grey
SIKA
Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.
Read more| Sikadur-30 is a thixotropic, structural 2-component adhesive, based on a combination of epoxy resins and special fillers, designed for use at normal temperatures between +8 °C and +35 °C.
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UsageAdhesive for bonding structural reinforcement, particularly in structural strengthening works. Especially for the following uses:
AdvantagesSikadur-30 has the following advantages:
Packaging
ColourComponent A: white Component B: black Components A+B mixed: light grey | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technical Information Compressive Strength Curing Time Curing Temperature +10 °C +35 °C 12 hours - ~85 N/mm2 1 day ~55 N/mm2 ~90 N/mm2 Modulus of Elasticity in Compression ~9 600 N/mm2 (at 23 °C) (ASTM D 695) Tensile Strength Curing Time Curing Temperature +15 °C +35 °C 1 day ~20 N/mm2 ~26 N/mm2 3 days ~23 N/mm2 ~27 N/mm2 Shear Strength Curing time Curing Temperature +15 °C +23 °C +35 °C 1 day ~4 N/mm2 - ~17 N/mm2 3 days ~15 N/mm2 - ~18 N/mm2 ~18 N/mm2 (1) Concrete failure (~15 N/mm2) (1) (DIN EN ISO 4624) Tensile adhesion strength Curing time Substrate 7 days Concrete dry +23 °C > 4 N/mm2 * 7 days Steel +23 °C >21 N/mm2 *100% concrete failure Shrinkage 0.04 % (FIP: Fédération Internationale de la Précontrainte) Coefficient of Thermal Expansion 2.5 x 10−5 per °C (Temperature range: −20 °C to +40 °C) (EN 1770) Service Temperature −40 °C to +45 °C (when cured at +23 °C) Glass transition temperature Curing time Curing temperature TG 30 days +30 °C +52 °C Heat deflection temperature Curing time Curing temperature HDT 3 hours +80 °C +53 °C 6 hours +60 °C +53 °C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Application Information Mixing Ratio Component A : Component B = 3 : 1 by weight or volume Layer Thickness 30 mm max. Sag Flow
Squeezability
Product Temperature Sikadur-30 must be applied at temperatures between +8 °C and +35 °C. Ambient Air Temperature +8 °C min. / +35 °C max. Dew Point Beware of condensation. Substrate Temperature +8 °C min. / +35 °C max. Substrate Moisture Content Max. 4 % pbw Pot Life
The pot-life begins when the resin and hardener are mixed. It is shorter at high temperatures and longer at low temperatures. The greater the quantity mixed, the shorter the pot-life. To obtain longer workability at high temperatures, the mixed adhesive may be divided into portions. Another method is to chill components A+B before mixing them (although not below +5 °C). |