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  • Sikafloor-220 W Conductive, Conductive Water-Based Epoxy Resin for Esd Systems, Interior, 6 Kg

Sikafloor-220 W Conductive, Conductive Water-Based Epoxy Resin for Esd Systems, Interior, 6 Kg

Cod produs: PTG259.00168
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Sikafloor-220 W Conductive, Conductive Water-Based Epoxy Resin for Esd Systems, Interior, 6 Kg

Cod produs: PTG259.00168
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Sikafloor-220 W Conductive, Conductive Water-Based Epoxy Resin for Esd Systems, Interior, 6 Kg

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    Sikafloor-220 W Conductive, Conductive Water-Based Epoxy Resin for Esd Systems, Interior, 6 Kg

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    Sikafloor-220 W Conductive is a two part, water dispersed, epoxy resin with a high electrostatic conductivity. Sikafloor-220 W Conductive is a part of different systems. For more details please refer to the System Data Sheet mentioned under the parapraph SYSTEM INFORMATION.

    • Highly electrostatic conductive
    • Easy application
    • Economical in use
    Usage
    • Sikafloor-220 W Conductive must be applied as conductive primer underneath all Sikafloor conductive wearing courses, such as Sikafloor-262 AS N, 262 AS N Thixo, -235 ESD, -381 ECF and -390 ECF.
    • Electrostatic conductive coatings on concrete and cementitious screeds for different types of industrial use.
    Advantages
    • Highly electrostatic conductive
    • Easy application
    • Economical in use
     
    Packaging

    Part A

    4.98 kg containers

    Part B

    1.02 kg containers

    Part A + B

    6 kg unipacks
    Colour

    Resin - part A

    black, liquid

    Hardener - part B

    white, liquid   
    Technical Information
    Electrostatic Behaviour

    Typical average resistance to ground: Rg ≤ 104 Ω

    		(DIN EN 1081)

    * Readings may vary, depending on ambient conditions (i.e. temperature, humidity) and measurement equipment.
    Application Information
    Mixing Ratio

    Part A : part B = 83 : 17 (by weight)
    Ambient Air Temperature

    +10 °C min. / +30 °C max.
    Relative Air Humidity

    75 % r.h. max.
    Dew Point

    Beware of condensation!
    The substrate and uncured floor must be at least 3 °C above dew point to reduce the risk of condensation or blooming on the floor finish.
    Substrate Temperature

    +10 °C min. / +30 °C max.
    Substrate Moisture Content

    < 4 % moisture content. Test method: Sika-Tramex meter, CM - measurement or Oven-dry-method. No rising moisture according to ASTM (Polyethylene-sheet).
    Pot Life

    Temperatures

    Time

    +10 °C

    ~120 minutes

    +20 °C

    ~90 minutes

    +30 °C~30 minutes
    Curing Time

    Before overcoating Sikafloor-220 W Conductive allow:

    Substrate temperature

    Minimum

    Maximum

    +10 °C

    		26 hours7 days

    +20 °C

    		17 hours5 days
    +30 °C12 hours4 days

    Times are approximate and will be affected by changing ambient conditions particularly temperature and relative humidity.
    Applied Product Ready for Use

    Temperature

    Foot traffic

    +10°C

    ~ 26 hours

    +20°C

    ~ 13 hours

    +30°C~ 8 hours

    The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.

    Contact our sales team for other specifications or custom made products.
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    General Specifications
    Packaging Part A: 4.98 kg; Part B: 1.02 kg; Part A + B: 6 kg unipacks
    Chemical Base Waterborne epoxy
    Usage Conductive primer for electrostatic flooring systems
    Application Method Roller
    Usage Area Interior
    Color Resin - part A black liquid; Hardener - part B white liquid
    Ambient Air Temperature +10 °C min. / +30 °C max.
    Storage Conditions The packaging must be stored properly in original, unopened and undamaged sealed packaging, in dry conditions at temperatures between +5 °C and +30 °C. Part A and part B must be protected from frost.
    Curing Time N/A
    Working Time +10 °C ~ 120 minutes; +20 °C ~ 90 minutes; +30 °C ~ 30 minutes
    Density Part A: 1.15 kg/L; Part B: 1.06 kg/L; Mixed Resin: 1.04 kg/L
    Consumption 0.08 - 0.10 kg/m²
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