Sika Primer MB, Amorsa epoxidica bicomponenta si bariera de umiditate pentru pardoseli din lemn, Interior, Albastru
SIKA
Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.
Read moreSika® Primer MB is a 2-component epoxy primer and moisture barrier for SikaBond wood flooring adhesives applied on difficult substrates.
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UsageSika® Primer MB is designed for use in conjunction with SikaBond wood flooring adhesives:
Advantages
Packaging
ColourBlue | ||||||||||||||||||||||||||||
Technical InformationShore A Hardness
Compressive Strength
Thermal Resistance
Sika® Primer MB can be permanently exposed to dry heat ≤ +50 °C and temporarily exposed to dry heat ≤ +80 °C. Note: In order to avoid damage to the installed wood floor elements, surface temperature must not exceed +25 °C.
Service Temperature
−40 °C min. / +70 °C max.
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Application InformationMixing Ratio Component A : Component B = 100:37 (by volume) Ambient Air Temperature +10 °C min. / +30 °C max., min. 3 °C above dew point temperature Relative Air Humidity < 80 % Substrate Temperature During laying and until Sika® Primer MB has fully cured, the substrate and ambient temperatures shall be between +10 °C and +30 °C without and between +20 °C and +30 °C with underfloor heating. Substrate Moisture Content Permissible substrate moisture content without underfloor heating
Permissible substrate moisture content for use with underfloor heating
To check the moisture content, use the “Rubber Mat Test”, according to ASTM. A polyethylene sheet of > 1x1 m in dimension shall be taped to the concrete surface. Leave the polyethylene sheet in place for > 24 hours prior to testing. This test allows for the detection of any condensed vapour transmissions. Pot Life
Note: Do not use mixed material after pot life. Curing Time
Note: Curing speed is dependent on temperature, relative humidity and absorption of substrates. High temperature and low r.h. decrease curing time. Cured material becomes transparent.
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