Solvent Free Resin Primer and Damp Proof Membrane for Cement Based Substrates SikaBond® Rapid DPM is a single part moisture curing polyurethane. - 1-part, ready to use.
- Rapid drying (approx 45 minutes at 50 % r.h. & 20 °C).
- Compatible with all SikaBond® wood floor adhesives.
- Especially suited to refurbishment projects where old adhesive residues are present.
- Suitable for underfloor heating.
- Applied by roller or squeegee.
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Usage For priming, consolidating and sealing of: - Absorbent and non-absorbent sub-floors, consolidating weak cement screed and isolation of old adhesive residues.
- Can be used as a Damp Proof Membrane on sub-floors not under hydrostatic pressure.
- Can be used over underfloor heating. (Max 3 % moisture CM Method, 4.5 % Tramex).
Advantages - 1-part, ready to use.
- Rapid drying (approx 45 minutes at 50 % r.h. & 20 °C).
- Compatible with all SikaBond® wood floor adhesives.
- Especially suited to refurbishment projects where old adhesive residues are present.
- Suitable for underfloor heating.
- Applied by roller or squeegee.
Skinning / Laying Time ~10-20 minutes (+20 °C 50 % r.h.) Sag Flow Consistency:
Spreads easily when applied using brush, squeegee or short/medium pile roller |
Technical Information Service Temperature Up to + 35 °C
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Application Information Ambient Air Temperature Room temperature above +10 °C. Relative air humidity < 75 %.
For ambient temperatures the standard construction rules are relevant. Relative Air Humidity Between 40 % and 75 %. Substrate Temperature During laying and until SikaBond® Rapid DPM has fully cured substrate temperature must be at least + 10 °C and in the case of underfloor heating < + 20 °C. For substrate temperatures the standard construction rules are relevant. Substrate Moisture Content Maximum substrate moisture content : - 4 % CM for cement screed (ca. 6 % Tramex / Gravimetric weight percent).
- 0.5 % CM for anhydrite screed.
- 3 - 12 % CM for magnesia flooring (proportion of organic parts).
Maximum substrate moisture content in case of underfloor heating: - 3 % CM for cement screed (ca. 4.5 % Tramex / Gravimetric weight percent).
- 0.3 % CM for anhydrite screed.
- 3 - 12 % CM for magnesia flooring (proportion of organic parts).
For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed. Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2 % CM (ca.2.5 % Tramex). Curing Time Approximately 45 minutes at 20 °C & 50 % r.h. |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.
