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SikaBond Rapid DPM, Solvent-free Resin Primer and Damp Proof Membrane, Interior/exterior, Brown, 5 L

SikaBond Rapid DPM, Solvent-free Resin Primer and Damp Proof Membrane, Interior/exterior, Brown, 5 L

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SIKA

Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.

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General Specifications
Ambalaj 5 L
Lăţime mm
Lungime m
Greutate Kg
Utilizare For priming, consolidating and sealing of:Absorbent and non-absorbent sub-floors, consolidating weak cement screed and isolation of old adhesive residues.Can be used as a Damp Proof Membrane on sub-floors not under hydrostatic pressure.Can be used over underfloor heating. (Max 3 % moisture CM Method, 4.5 % Tramex)
Baza chimică Polyethylene with curing agent, acrylic dispersion
Zona de utilizare Interior/Exterior
Culoare Brown
Condiții de depozitare Store in tightly closed undamaged original sealed containers, in dry conditions and protected from direct sunlight at temperatures between +5 °C and +25 °C
Densitate 1.16 g/cm³
Consum Apply 1 coat at a minimum consumption of 100 – 200 g/m² (85-170 ml/m²).

Solvent Free Resin Primer and Damp Proof Membrane for Cement Based Substrates

SikaBond® Rapid DPM is a single part moisture curing polyurethane.

  • 1-part, ready to use.
  • Rapid drying (approx 45 minutes at 50 % r.h. & 20 °C).
  • Compatible with all SikaBond® wood floor adhesives.
  • Especially suited to refurbishment projects where old adhesive residues are present.
  • Suitable for underfloor heating.
  • Applied by roller or squeegee.
Usage
For priming, consolidating and sealing of:
  • Absorbent and non-absorbent sub-floors, consolidating weak cement screed and isolation of old adhesive residues.
  • Can be used as a Damp Proof Membrane on sub-floors not under hydrostatic pressure.
  • Can be used over underfloor heating. (Max 3 % moisture CM Method, 4.5 % Tramex).
 
Advantages
  • 1-part, ready to use.
  • Rapid drying (approx 45 minutes at 50 % r.h. & 20 °C).
  • Compatible with all SikaBond® wood floor adhesives.
  • Especially suited to refurbishment projects where old adhesive residues are present.
  • Suitable for underfloor heating.
  • Applied by roller or squeegee.
Skinning / Laying Time ~10-20 minutes (+20 °C  50 % r.h.) Sag Flow Consistency:
Spreads easily when applied using brush, squeegee or short/medium pile roller
Packaging

5 L Jerry can.
Colour

Brown.
Technical Information
Service Temperature

Up to + 35 °C

 

Application Information
Ambient Air Temperature

Room temperature above +10 °C. Relative air humidity < 75 %.
For ambient temperatures the standard construction rules are relevant.
Relative Air Humidity

Between 40 % and 75 %.
Substrate Temperature

During laying and until SikaBond® Rapid DPM has fully cured substrate temperature must be at least + 10 °C and in the case of underfloor heating < + 20 °C. For substrate temperatures the standard construction rules are relevant.
Substrate Moisture Content

Maximum substrate moisture content :

  • 4 % CM for cement screed (ca. 6 % Tramex / Gravimetric weight percent).
  • 0.5 % CM for anhydrite screed.
  • 3 - 12 % CM for magnesia flooring (proportion of organic parts).

Maximum substrate moisture content in case of underfloor heating:

  • 3 % CM for cement screed (ca. 4.5 % Tramex / Gravimetric weight percent).
  • 0.3 % CM for anhydrite screed.
  • 3 - 12 % CM for magnesia flooring (proportion of organic parts).

For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed. Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2 % CM (ca.2.5 % Tramex).
Curing Time

Approximately 45 minutes at 20 °C & 50 % r.h.