Sikafloor-2350 Esd, Electrostatic Dissipative Epoxy Floor Coating, Interior, 30 Kg
SIKA
Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.
Read more| Electrostatic dissipative epoxy floor coating Sikafloor-2350 ESD is a 2-part self smoothing coloured electrostatic dissipative epoxy resin floor coating.
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UsageThe Product can be used as a: Smooth electrostatically conductive floor covering Please note:
Advantages
Packaging
Colour
Please contact Sika customer service for information on availability. Note: When the product is exposed to direct sunlight, there may be some discolouration and colour variation. This has no influence on the function and performance of the coating. | ||||||||||||||||||||||||||||||||||||
Technical Information Shore D Hardness ~80 (after 7 days at +23 °C) (EN ISO 868) Abrasion Resistance ~1.29 g, resin filled 20% with QS (H22/1000/1000) (af-ter 20 days at +23°C) (EN ISO 5470-1) Compressive Strength Cured 28 days at +23 °C ~120 MPa Flexural Strength Cured 28 days at +23 °C ~30 MPa Tensile adhesion strength > 1,5 N/mm² (failure in concrete) (EN 1542) Electrostatic Behaviour Resistance to ground RG < 109 Ω This product fulfils the requirements of ATEX 137 Typical average resistance to ground RG ≤ 105 Ω to 106 Ω Body voltage generation < 100 V System Resistance (Person/Floor/footwear) < 109 Ω Note: Measurement results can be affected by ESD clothing, ambient conditions, measurement equipment, cleanliness of the floor and the test personnel. Thermal Resistance Short-term, maximum 7 days +60 °C IMPORTANT: No simultaneous mechanical and chemical strain While the product is exposed to temperatures up to +60 °C, do not also subject it to chemical and/or mechanical strain, as it may cause damage to the product. | ||||||||||||||||||||||||||||||||||||
Application Information Mixing Ratio
Product Temperature
Ambient Air Temperature
Relative Air Humidity 80 % r.h. max. Dew Point Beware of condensation. The substrate and uncured applied product must be at least +3 °C above dew point to reduce the risk of condensation or blooming on the surface of the applied product. Low temperatures and high humidity conditions increase the probability of blooming. Substrate Temperature
Substrate Moisture Content < 4 % parts by weight (Sika Tramex moisture meter) No rising moisture (ASTM D4263, polyethylene sheet) The substrate must be visibly dry with no standing water. Pot Life
Applied Product Ready for Use
Note:Times are approximate and will be affected by changing ambient conditions, particularly temperature and relative humidity. |