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SikaBond-5500 S, Solvent-Based Rigid Wood Flooring Adhesive, Interior, Beige, 16 kg

Adhesives & Sealants
SIKA

Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.

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Solvent Based Rigid Adhesive for Wood Block & Engineered Wood flooring

SikaBond-5500 S is a solvent based rigid adhesive for bonding wood block parquet and engineered boards onto porous substrates. High strength bond, suitable for use with underfloor heating.

  • 1-part, ready to use.
  • High strength rigid bond.
  • Very good spreadability.
  • Excellent adhesion to all types of wood.
  • Adhesive can be sanded.
Usage
For full surface bonding of:
  • Traditional parquet blocks and mosaic parquet, industrial parquet and end grained wood paving on cement, anhydrite, and poured asphalt sub-floors.
  • Can be used over underfloor heating installations.
  • Especially suited to wood block refurbishment projects where bitumen adhesive residues are present.
 
Advantages
  • 1-part, ready to use.
  • High strength rigid bond.
  • Very good spreadability.
  • Excellent adhesion to all types of wood.
  • Adhesive can be sanded.
Packaging

16 kg metal pails

Colour

Beige

Technical Information
Service Temperature

up to 35 °C

Application Information
Sag Flow

Consistency: Spreads easily, trowel marks stable.

Ambient Air Temperature

Room temperature above +10 °C, ideally +15 °C. Relative air humidity < 75 %.

For ambient temperatures the standard construction rules are relevant.

Relative Air Humidity

Between 40% and 75%

Substrate Temperature

During laying and until SikaBond-5500 S has fully cured substrate temperature must be > + 10 °C and in the case of underfloor heating < + 20 °C.

For substrate temperatures the standard construction rules are relevant

Substrate Moisture Content

Maximum substrate moisture content :

  • 2.5 % CM (carbide meter) for cement screed (ca. 4 % Tramex / Gravimetric weight percent)
  • 0.5 % CM for anhydrite screed
  • 3 - 12 % CM for magnesia flooring (proportion of organic parts)

Maximum substrate moisture content in case of underfloor heating:

  • 1.8 % CM for cement screed (ca. 3 % Tramex / Gravimetric weight percent)
  • 0.3 % CM for anhydrite screed
  • 3 - 12 % CM for magnesia flooring (proportion of organic parts)

For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed.

Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2 % CM (ca.2.5 % Tramex).

Curing Rate

Floor may be walked on / sanded and finished approximately 48 - 72 hours after installation (depending on climatic conditions, absorbency of subfloor and adhesive layer thickness).

Skin Time / Laying Time

~ 10 - 20 minutes (+23 °C / 50 % r.h.)