Solvent Based Rigid Adhesive for Wood Block & Engineered Wood flooring SikaBond-5500 S is a solvent based rigid adhesive for bonding wood block parquet and engineered boards onto porous substrates. High strength bond, suitable for use with underfloor heating. - 1-part, ready to use.
- High strength rigid bond.
- Very good spreadability.
- Excellent adhesion to all types of wood.
- Adhesive can be sanded.
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Usage For full surface bonding of: - Traditional parquet blocks and mosaic parquet, industrial parquet and end grained wood paving on cement, anhydrite, and poured asphalt sub-floors.
- Can be used over underfloor heating installations.
- Especially suited to wood block refurbishment projects where bitumen adhesive residues are present.
Advantages - 1-part, ready to use.
- High strength rigid bond.
- Very good spreadability.
- Excellent adhesion to all types of wood.
- Adhesive can be sanded.
Packaging 16 kg metal pails |
Technical Information Service Temperature up to 35 °C
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Application Information Sag Flow Consistency: Spreads easily, trowel marks stable. Ambient Air Temperature Room temperature above +10 °C, ideally +15 °C. Relative air humidity < 75 %. For ambient temperatures the standard construction rules are relevant. Relative Air Humidity Between 40% and 75% Substrate Temperature During laying and until SikaBond-5500 S has fully cured substrate temperature must be > + 10 °C and in the case of underfloor heating < + 20 °C. For substrate temperatures the standard construction rules are relevant Substrate Moisture Content Maximum substrate moisture content : - 2.5 % CM (carbide meter) for cement screed (ca. 4 % Tramex / Gravimetric weight percent)
- 0.5 % CM for anhydrite screed
- 3 - 12 % CM for magnesia flooring (proportion of organic parts)
Maximum substrate moisture content in case of underfloor heating: - 1.8 % CM for cement screed (ca. 3 % Tramex / Gravimetric weight percent)
- 0.3 % CM for anhydrite screed
- 3 - 12 % CM for magnesia flooring (proportion of organic parts)
For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed. Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2 % CM (ca.2.5 % Tramex). Curing Rate Floor may be walked on / sanded and finished approximately 48 - 72 hours after installation (depending on climatic conditions, absorbency of subfloor and adhesive layer thickness). Skin Time / Laying Time ~ 10 - 20 minutes (+23 °C / 50 % r.h.) |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.
