High-performance epoxy adhesive for structural bonding Sikadur-33 is a thixotropic 2-part epoxy structural adhesive supplied in a cartridge. - Good adhesion to damp concrete surfaces.
- Very good adhesion to many construction materials.
- Thixotropic: non-sag in vertical and overhead applications.
- Very good load capacity.
- Hardens without shrinkage.
- Styrene-free.
- EPD available.
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Usage The Product is used as a structural adhesive for: - Concrete.
- Hard natural stone.
- Ceramics.
- Fibre cement.
- Mortar.
- Brick masonry.
- Hollow and solid masonry.
- Steel.
- Iron.
- Wood.
The Product is used for small concrete repairs such as: - Corners and edges.
- Hole and void filling.
- Joint arrises.
Joint filing and crack sealing: - Static crack filling and sealing.
- Handrails, balustrades and supports.
- Window frames, door frames, and windowsills.
Advantages - Good adhesion to damp concrete surfaces.
- Very good adhesion to many construction materials.
- Thixotropic: non-sag in vertical and overhead applications.
- Very good load capacity.
- Hardens without shrinkage.
- Styrene-free.
- EPD available.
Packaging 250 ml cartridge | Box of 12 × 250 ml | 400 ml side-by-side cartridge | Box of 12 × 400 ml |
Refer to the current price list for available packaging variations. Colour Part A | White | Part B | Grey | Part A+B mixed | Grey |
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Technical Information Compressive Strength Cured 14 days at +23 °C | 50 N/mm2 |
Flexural Strength Cured 14 days at +23 °C | 20 N/mm2 |
Tensile Strength Cured 14 days at +23 °C | 13 N/mm2 |
Tensile adhesion strength Curing Time | Substrate | Adhesion strength | 3 days | Concrete dry | > 5 N/mm2 (100 % concrete failure) | 3 days | Concrete moist | > 5 N/mm2 (100 % concrete failure) | 3 days | Steel sandblasted | > 10 N/mm2 | 3 days | Brick dry | > 1.5 N/mm2 (100 % brick failure) |
Shrinkage Hardens without shrinkage
Coefficient of Thermal Expansion 9.3 × 10-5 1/K Linear expansion between +23 °C and +60 °C | (EN 1770) |
Glass transition temperature Cured 7 days at +23 °C | +49 °C |
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Application Information Mixing Ratio Part A : Part B | 1 : 1 by volume |
Layer Thickness Maximum | 10 mm | Minimum | 0.5 mm |
Sag Flow Non-sag, suitable for overhead application Product Temperature Maximum | +35 °C | Minimum | +10 °C |
Ambient Air Temperature Maximum | +35 °C | Minimum | +10 °C |
Dew Point Beware of condensation. Substrate temperature during application must be at least +3 °C above dew point. Substrate Temperature Maximum | +35 °C | Minimum | +10 °C |
Substrate Moisture Content Substrates must be dry or matt damp (no standing water). Pot Life Tested at +23 °C | 60 minutes |
Open Time | Temperature | Open Time | | +10 °C | 210 minutes | | +20 °C | 90 minutes | | +35 °C | 45 minutes |
Minimum cartridge temperature +10 °C Curing Time Temperature | Curing Time | +10 °C | 3 days (80 % of performance) | +20 °C | 2 days (80 % of performance) | +35 °C | 1 day (80 % of performance) |
Minimum cartridge temperature +10 °C |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.
