Solvent and styrene free based, two-component polyester anchoring adhesive. - Fast curing
- Standard guns can be used
- Can be used at low temperatures
- High load capacity
- ETA Approval available
- Non-sag, even overhead
- Styrene-free
- Low odour
- Low wastage
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Usage As a fast curing anchoring adhesive for all grades of: - Rebars / reinforcing steel
- Threaded rods
- Bolts and special fastening systems
- Concrete
- Hollow and solid masonry
- Hard natural stone*
- Solid rock*
* These substrates may vary greatly, in particular with regard to strength, composition and porosity. Therefore, for each application the suitability of Sika AnchorFix-1 Adhesive must be tested by first applying Sika AnchorFix-1 Adhesive only to a sample area. Check in particular bond strength, surface staining and discolouration. Advantages - Fast curing
- Standard guns can be used
- Can be used at low temperatures
- High load capacity
- ETA Approval available
- Non-sag, even overhead
- Styrene-free
- Low odour
- Low wastage
Packaging 300 ml standard cartridge | 12 cartridges per box pallet: 75 boxes | Colour Component A: | white | Component B: | black | Component A+B mixed: | light grey | |
Technical Information Compressive Strength ~60 N/mm2 (7 days, +20 °C) | (ASTM D 695) |
Modulus of Elasticity in Compression ~3 500 N/mm2 (7 days, +20 °C) | (ASTM D 695) |
Flexural Strength ~28 N/mm2 (7 days, +20 °C) | (ASTM D 790) |
Tensile Strength ~12 N/mm2 (7 days, +20 °C) | (ASTM D 638) |
Thermal Resistance Long term | +50 °C | Short term (1–2 hours) | +80 °C |
Glass Transition Temperature +60 °C | (DIN EN ISO 6721-1) |
Design Considerations For details about adhesive anchoring design refer to the separate documentation provided: “Technical Documentation Sika AnchorFix-1” Ref: 870 43 01 |
Application Information Mixing Ratio Component A : component B = 10 : 1 by volume Layer Thickness 3 mm max. Sag Flow Non-sag, even overhead Product Temperature Sika AnchorFix-1 must be at a temperature of between +5 °C and +40 °C for application. Ambient Air Temperature -10 °C min. / +40 °C max. Dew Point Beware of condensation. Substrate temperature during application must be at least 3 °C above dew point. Substrate Temperature -10 °C min. / +40 °C max. Curing Time Temperature | Open time - Tgel | Curing time - Tcur | +30 °C | 4 minutes | 35 minutes | +25 °C – +30 °C | 4 minutes | 40 minutes | +20 °C – +25 °C | 5 minutes | 50 minutes | +10 °C – +20 °C | 6 minutes | 85 minutes | +5 °C – +10 °C | 10 minutes | 145 minutes | +5 °C | 18 minutes | 145 minutes | –10 °C 1 2 | 30 minutes | 24 hours |
1 Minimum cartridge temperature: +5 °C 2 This application is not covered by the scope of the product ETA or any other approval. |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.