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Sikasil Pool, Neutral Cure Silicone for Pools & Wet Areas, Interior & Exterior, 300 mL

Adhesives & Sealants
SIKA

Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.

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Sikasil Pool is a one component, neutral curing silicone sealant for use in surrounding areas of swimming pools and permanently wet areas.

  • Very good water resistance.
  • High chlorine resistance.
  • Very good resistance to fungal attack.
  • Non-corrosive.
  • High elasticity and flexibility.
Usage
Sikasil Pool is designed for joints around swimming pools, areas under permanent water immersion and frequently wet areas between tiles, concrete, glass and metals.  
Advantages
  • Very good water resistance.
  • High chlorine resistance.
  • Very good resistance to fungal attack.
  • Non-corrosive.
  • High elasticity and flexibility.
Packaging

300 ml cartridges, 12 cartridges per box

Colour

White and grey

Technical Information
Shore A Hardness

~20 (after 28 days)

(ISO 868)

Tensile Strength

~1.5 N/mm2

(ISO 8339)

Secant Tensile Modulus

~0.30 N/mm2 at 100 % elongation (23 °C)

(ISO 8339)

Elastic Recovery

> 90 %

(ISO 7389)

Tear Propagation Resistance

~4.0 N/mm

(ISO 34)

Movement Capability

± 25 %

(ISO 9047)

Service Temperature

−40 °C to +80 °C

Joint Design

The joint width must be designed to suit the joint movement required and the movement capability of the sealant. The joint width shall be ≥ 10 mm. Sikasil Pool shall not be used on joints with widths ≥ 15 mm and depths or thicknesses ≥ 6 mm must be applied.

For larger joints please contact Sika Technical Service.

Application Information
Backing Material

Use closed cell, polyethylene foam backing rods.

Sag Flow

< 2 mm (20 mm profile, 23 °C)

(ISO 7390)

Ambient Air Temperature

+5 °C to +40 °C

Substrate Temperature

+5 °C to +40 °C, min. 3 °C above dew point temperature

Curing Rate

~2 mm/24 h  (23 °C / 50 % r.h.)

(CQP 049-2)

Skin Time

~5 minutes (23 °C / 50 % r.h.)

(CQP 019-1)