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SikaBond-52 Wood Floor, Solvent-Free Elastic Wood Flooring Adhesive, Interior, Parquet brown, 600 mL

SikaBond-52 Wood Floor, Solvent-Free Elastic Wood Flooring Adhesive, Interior, Parquet brown, 600 mL

Adhesives & Sealants
SIKA

Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.

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General Specifications
Packaging 600 mL
Usage Bonding Wood Floors (Solid, Engineered, Parquet)
Usage Area Interior
Color Parquet brown
Chemical Base 1-part Polyurethane, moisture curing
Storage Conditions +10 °C to +25 °C - Store in sealed containers, dry conditions, protected from sunlight.
Density 1.29 kg/L
Service Temperature -40 >< +70
Application Time 10 - 15 min.
Curing Time 24 hours
Application Thickness 2 >< 3 mm
Application Method Gun
UV Resistant Yes
Moisture Resistant Yes
Mold Resistant No
Paintable No
Sealant Yes
Flexible Yes

Solvent-free elastic adhesive for Wood Flooring

SikaBond-52 Wood Floor is a fast-curing elastic wood flooring adhesive for professional use. Ideal for bonding wood floors using liquid batten/beaded application. Use with solid, engineered, parquet wood floors and chipboard.

  • 1-component, ready to use.
  • Fast curing properties.
  • Floor can be sanded after 12 hours (full surface bonding, +23°C / 50% r. h., up to 1 mm adhesive thickness).
  • Excellent workability, very easy to extrude.
  • Good initial tack.
  • Elastic, footfall sound-dampening adhesive.
  • Suitable for most common types of wood floors.
  • Especially suitable for problematic woods including beech, maple and bamboo.
  • Suitable for bonding wood floors directly onto old ceramic tiles.
  • Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate.
  • Suitable for use with subfloor heating.
  • Compensates for some substrate unevenness.
  • Adhesive can be sanded.
  • Solvent free.
  • Odourless.
Usage
For Full Surface bonding: Solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, lam parquet, wood paving (residential) as well as chipboard, plywood and OSB can be bonded. For the Sika AcouBond-System: Solid wood boards (tongued and grooved), 3-ply engineered wood, chipboard, plywood and herringbone blocks can all be bonded. For detailed application instructions refer to the Product Data Sheet of the Sika AcouBond-System, or contact our Technical Department. For Beaded Application: Solid wood boards, 3-ply engineered wood and chipboard can be bonded.  
Advantages
  • 1-component, ready to use.
  • Fast curing properties.
  • Floor can be sanded after 12 hours (full surface bonding, +23°C / 50% r. h., up to 1 mm adhesive thickness).
  • Excellent workability, very easy to extrude.
  • Good initial tack.
  • Elastic, footfall sound-dampening adhesive.
  • Suitable for most common types of wood floors.
  • Especially suitable for problematic woods including beech, maple and bamboo.
  • Suitable for bonding wood floors directly onto old ceramic tiles.
  • Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate.
  • Suitable for use with subfloor heating.
  • Compensates for some substrate unevenness.
  • Adhesive can be sanded.
  • Solvent free.
  • Odourless.
Packaging

600ml Foil
Colour

Parquet brown
Technical Information
Shore A Hardness

~ 34 (after 28 days)

Tensile Strength

~ 1.4 N/mm2, (+23°C / 50% r. h.)

Shear Strength

~ 1.1 N/mm2 , 1 mm adhesive thickness (+23°C / 50% r. h.)

Service Temperature

-40°C to +70°C
Application Information
Sag Flow

Consistency: Spreads easily, trowel marks stable. Easily applied by guns.
Ambient Air Temperature

Ambient temperature between +15°C and +35°C. For ambient temperatures the standard construction rules are relevant.
Relative Air Humidity

Between 40% and 70%.
Substrate Temperature

During laying and until SikaBond-52 Wood Floor has fully cured the substrate and ambient temperatures should be > +15°C and with floor heating approx. < +20°C. For substrate temperatures the standard construction rules are relevant.
Substrate Moisture Content

Permissible substrate moisture content:

  • 2.5% CM for cement screed (ca. 4% Tramex / Gravimetric weight percent).
  • 0.5% CM for anhydrite screed.
  • 3 - 12% CM for magnesite flooring (dependent on proportion of organic components).

Permissible substrate moisture content for use with underfloor heating:

  • 1.8% CM for cement screed (ca. 3% Tramex / Gravimetric weight percent).
  • 0.3% CM for anhydrite screed.
  • 3 - 12% CM for magnesite flooring (dependent on the proportion of organic components).

For moisture contents and the quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed.
Curing Rate

~ 3.5 mm / 24h (+23°C / 50% r. h.)

The floor may be walked on / sanded 12 hours to 24 hours after installation ( +23°C / 50% r. h. up to 1 mm adhesive thickness dependent on climatic conditions and adhesive layer thickness).
Skin Time / Laying Time

~ 60 minutes (+23°C / 50% r. h.)