Sikafloor-82 EpoCem, Epoxy-Cement Slab, 4-7mm

At temperatures between +12 °C (+54 °F) to +25 °C (+77 °F):

At temperatures between +8 °C (+46 °F) to +12 °C (+54 °F) and +25 °C (+77 °F) to +30 °C (+86 °F):

The amount of part C can be reduced to 24 kg (52.9 lb) in order to improve workability. Never reduce part C by more than this amount.

Note: For this application, to achieve a good bond of the mortar to the substrate, SikaTop® Armatec®-110 EpoCem® must be used as a primer. Apply the mortar wet on wet to the primer.

Note: If the Product is used as a Temporary Moisture Barrier (TMB), a minimum of 3 mm (0.118 in) must be applied.

Can be applied on green or damp concrete, without any standing water. Although the product can be applied onto green concrete surfaces (> 24 hours), it is advised to allow at least 3 days for early shrinkage of concrete to occur in order to prevent concrete shrinkage cracks from appearing on the screed surface.

Once Sikafloor®-82 EpoCem® is tack free it is possible to apply vapour permeable seal coats.

For the application of vapour tight coatings on Sikafloor®-82 EpoCem®, allow the surface moisture to fall below 4 %, not earlier than:

Note: Consumption data is theoretical and does not allow for any additional material due to surface porosity, surface profile, variations in level, wastage or any other variations. Apply product to a test area to calculate the exact consumption for the specific substrate conditions and proposed application equipment.

MIXING EQUIPMENT

• Electric double paddle mixer (>700 W, 300 to 400 rpm)
• Alternatively pan type revolving or forced action mixers can be used.

APPLICATION EQUIPMENT

• Smoothing trowel
• Spiked roller

IMPORTANT

Incorrect treatment of cracks

The incorrect assessment and treatment of cracks may lead to a reduced service life and reflective cracking.

TREATMENT OF JOINTS AND CRACKS

Construction joints and existing static surface cracks in substrate require pre-treating before full layer application. Use Sikadur® or Sikafloor® resins.

SUBSTRATE CONDITION

Cementitious substrates (concrete / screed) must be structurally sound and of sufficient compressive strength (minimum 25 N/mm 2 (3626 psi) ) with a minimum tensile strength of 1.5 N/mm 2 (218 psi) .

MECHANICAL SUBSTRATE PREPARATION

IMPORTANT

Exposing blow holes and voids

When mechanically preparing the surface, make sure to fully expose blow holes and voids.

1. Remove weak cementitious substrates.
2. Prepare cementitious substrates mechanically using abrasive blast cleaning or planing / scarifying equipment to remove cement laitance.
3. Before applying thin layer resins, remove high spots by grinding.
4. Use industrial vacuuming equipment to remove all dust, loose and friable material from the application surface before applying the Product.
5. Use products from the Sikafloor®, Sikadur® and Sikagard® range of materials to level the surface or fill cracks, blow holes and voids.

Contact Sika® Technical Services for additional information on products for levelling and repairing defects.

SUBSTRATE PREPARATION OF NON-CEMENTITIOUS SUBSTRATES

For information on substrate preparation of non-cementitious substrates, contact Sika technical services.

IMPORTANT

Addition of water

Do not add water to the mix or for finishing as this will affect the performance, surface finish and cause discolouration.

IMPORTANT

Unsuitable mixing equipment

Do not use free fall mixers.

IMPORTANT

Avoid over-mixing to minimise air entrainment.

1. Mix Part A (resin) for ~10 seconds with an electric double paddle mixer (300–400 rpm, > 700 W).
2. Add Part B (hardener) to Part A.
3. Mix for a further 2 minutes until a uniform mix is achieved.
4. While mixing Parts A + B, gradually add the Part C.
5. Mix continuously for 3 minutes, until a uniform mix is achieved.
6. To ensure thorough mixing, pour materials into another container and mix again to achieve a smooth and uniform mix.
7. During the final mixing stage, scrape down the sides and bottom of the mixing container with a flat or straight edge trowel at least once to ensure complete mixing.

IMPORTANT

Strictly follow installation procedures

Strictly follow installation procedures as defined in Method Statements, application manuals and working instructions which must always be adjusted to the actual site conditions.

IMPORTANT

Protect from moisture

After application, protect the Product from damp, condensation and direct water contact for at least 24 hours.

IMPORTANT

Ventilation in confined spaces

Always ensure good ventilation when applying the Product in a confined space.

IMPORTANT

Pin holes

If the Product is applied on porous substrates during rising temperatures, pin holes may form from rising air.

1. Apply the Product during falling temperatures.

IMPORTANT

Do not use curing compounds

Applications under extreme conditions (high temperature and low humidity) which can cause fast drying of the product must be avoided as the product does not allow the use of curing compounds.

IMPORTANT

Protect fresh Product from direct sunlight and draughts

To reduce the risk of cracking, protect freshly applied product from high ambient temperatures, direct sunlight and draughts.

1. Pour the mixed Product onto the substrate. Note: The consumption is specified in Application Information.
2. Apply the Product evenly over the surface with a trowel.
3. Back roll the surface in two directions at right angles with a spike roller. Note: Maintain a "wet edge" during application to achieve a seamless finish.

Overcoating with PMMA

Note: When overlaying with PMMA screeds, the Product surface must be fully broadcast with clean and dry quartz sand.

Moisture barrier

Note: The TMB effect is limited in time without additional preparation. Always verify the surface moisture content if more than 5 days have passed since application.

Clean all tools and application equipment with water immediately after use. Hardened material can only be removed mechanically.