Sikaflex-250 PC, Warm Applied Adhesive Easy Application, Interior & Exterior, Black, 195 L
SIKA
Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.
Read more| Warm applied adhesive with exceptional application properties Sikaflex-250 PC is an elastic 1 component polyurethane adhesive that cures on exposure to atmospheric humidity. Sikaflex-250 PC is applied at a temperature of 85 °C and develops extraordinary application properties and high initial strength. As such it is eminently well suited for medium to large production runs.
| |||||||||||||||||||||||||||||||||||||||||||||||||||||
PRODUCT BENEFITS
UsageSikaflex-250 PC fits bonding applications in automated processes best. It can also be used for standard non automated lines. Seek manufacturer’s advice and perform tests on original substrates before using Sikaflex-250 PC on materials prone to stress cracking. Sikaflex-250 PC is suitable for experienced professional users only. Test with actual substrates and conditions have to be performed to ensure adhesion and material compatibility.Packaging
| |||||||||||||||||||||||||||||||||||||||||||||||||||||
Typical Product Data
| |||||||||||||||||||||||||||||||||||||||||||||||||||||
Technical Information CURE MECHANISM Sikaflex-250 PC cures by reaction with atmospheric moisture. At low temperatures the water content of the air is generally lower and the curing reaction proceeds somewhat slower (see diagram 1). Diagram 1: Curing speed Sikaflex-250 PC CHEMICAL RESISTANCE Sikaflex-250 PC is generally resistant to fresh water, seawater, diluted acids and diluted caustic solutions; temporarily resistant to fuels, mineral oils, vegetable and animal fats and oils; not resistant to organic acids, glycolic alcohol, concentrated mineral acids and caustic solutions or solvents. | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Application Information Surface Preparation Surfaces must be clean, dry and free from grease, oil, dust and contaminants. Application Sikaflex-250 PC can be processed at climate conditions between 5 °C and 40 °C, but changes in reactivity and application properties have to be considered. The optimum climate and substrate temperature is between 15 °C and 25 °C. Sikaflex-250 PC need to be heated up to 85 °C prior the application. Application equipment must be hence capable to heat up the required amount of adhesive to the required temperature. For cartridges, this usually takes 60 minutes in a cartridge oven set at 85 °C. Cartridges can be re-heated form cold several times, but must not be kept at 85 °C for more than 10 hours in total. To ensure a uniform thickness of the bondline it is recommended to apply the adhesive in form of a triangular bead (see figure 1).
Figure 1: Recommended bead configuration Sikaflex-250 PC can be processed with hand, pneumatic or electric driven piston guns as well as pump equipment. The open time is significantly shorter in hot and humid climate. The parts must always be installed within the open time. Never join bonding parts if the adhesive has built a skin. For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry. Removal Uncured Sikaflex-250 PC can be removed from tools and equipment with Sika Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically. Hands and exposed skin have to be washed immediately using hand wipes such as Sika Cleaner-350H or a suitable industrial hand cleaner and water. Do not use solvents on skin. |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.| Warm applied adhesive with exceptional application properties Sikaflex-250 PC is an elastic 1 component polyurethane adhesive that cures on exposure to atmospheric humidity. Sikaflex-250 PC is applied at a temperature of 85 °C and develops extraordinary application properties and high initial strength. As such it is eminently well suited for medium to large production runs.
| |||||||||||||||||||||||||||||||||||||||||||||||||||||
PRODUCT BENEFITS
UsageSikaflex-250 PC fits bonding applications in automated processes best. It can also be used for standard non automated lines. Seek manufacturer’s advice and perform tests on original substrates before using Sikaflex-250 PC on materials prone to stress cracking. Sikaflex-250 PC is suitable for experienced professional users only. Test with actual substrates and conditions have to be performed to ensure adhesion and material compatibility.Packaging
| |||||||||||||||||||||||||||||||||||||||||||||||||||||
Typical Product Data
| |||||||||||||||||||||||||||||||||||||||||||||||||||||
Technical Information CURE MECHANISM Sikaflex-250 PC cures by reaction with atmospheric moisture. At low temperatures the water content of the air is generally lower and the curing reaction proceeds somewhat slower (see diagram 1). Diagram 1: Curing speed Sikaflex-250 PC CHEMICAL RESISTANCE Sikaflex-250 PC is generally resistant to fresh water, seawater, diluted acids and diluted caustic solutions; temporarily resistant to fuels, mineral oils, vegetable and animal fats and oils; not resistant to organic acids, glycolic alcohol, concentrated mineral acids and caustic solutions or solvents. | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Application Information Surface Preparation Surfaces must be clean, dry and free from grease, oil, dust and contaminants. Application Sikaflex-250 PC can be processed at climate conditions between 5 °C and 40 °C, but changes in reactivity and application properties have to be considered. The optimum climate and substrate temperature is between 15 °C and 25 °C. Sikaflex-250 PC need to be heated up to 85 °C prior the application. Application equipment must be hence capable to heat up the required amount of adhesive to the required temperature. For cartridges, this usually takes 60 minutes in a cartridge oven set at 85 °C. Cartridges can be re-heated form cold several times, but must not be kept at 85 °C for more than 10 hours in total. To ensure a uniform thickness of the bondline it is recommended to apply the adhesive in form of a triangular bead (see figure 1).
Figure 1: Recommended bead configuration Sikaflex-250 PC can be processed with hand, pneumatic or electric driven piston guns as well as pump equipment. The open time is significantly shorter in hot and humid climate. The parts must always be installed within the open time. Never join bonding parts if the adhesive has built a skin. For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry. Removal Uncured Sikaflex-250 PC can be removed from tools and equipment with Sika Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically. Hands and exposed skin have to be washed immediately using hand wipes such as Sika Cleaner-350H or a suitable industrial hand cleaner and water. Do not use solvents on skin. |