Epoxy impregnating / laminating resin for SikaWrap structural strengthening fabrics Sikadur-300 is a 2-part, epoxy based impregnating / laminating resin for SikaWrap structural strengthening fabrics. - Easy to mix.
- Application by impregnation roller.
- Formulated for manual or mechanical saturation methods.
- Good adhesion to many substrates.
- High mechanical properties.
- Extra long pot-life.
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Usage - As an impregnating / laminating resin for the SikaWrap fabric reinforcement wet application method.
- As a substrate primer for the wet application method.
Advantages - Easy to mix.
- Application by impregnation roller.
- Formulated for manual or mechanical saturation methods.
- Good adhesion to many substrates.
- High mechanical properties.
- Extra long pot-life.
Packaging Part A | 22,305 kg pre-batched unit | Part B | 7,695 kg pre-batched unit | Bulk containers | Refer to current price list |
Refer to current price list for packaging variations Colour Part A | ~amber liquid | Part B | ~pale yellow liquid | Parts A + B mixed | ~light-yellow liquid | |
Technical Information Flexural E-Modulus ~2800 N/mm2 (7 days at +23 °C) | (DIN EN 1465) |
Tensile Strength ~45 N/mm2 (7 days at +23 °C) | (ISO 527) |
Tensile adhesion strength Concrete fracture (> 4 N/mm2) on sandblasted substrate | (EN ISO 4624) |
Coefficient of Thermal Expansion ~6,0 × 10−5 (±0,2 × 10–5) 1/K | (EN 1770) |
(linear expansion between -20 °C and +40 °C) Service Temperature –40 °C to +45 °C Glass transition temperature Curing time | Curing temperature | TG | 30 days | +30 °C | +53 °C |
Heat deflection temperature Curing time | Curing temperature | HDT | 7 days | +15 °C | +43 °C | 7 days | +23 °C | +49 °C | 3 days | +40 °C | +60 °C | 7 days | +40 °C | +66 °C |
Resistant to continuous exposure +45 °C. |
Application Information Mixing Ratio Part A : Part B = 100 : 34,5 by weight Ambient Air Temperature +15 °C min. / +40 °C max. Dew Point Beware of condensation. The substrate and uncured applied resin must be at least +3 °C above dew point to reduce the risk of condensation or blooming on the resin surface. Substrate Temperature +15 °C min. / +40 °C max. Substrate Moisture Content ≤ 4 % parts by weight The following test methods can be used: Sika-Tramex meter, CM-measurement or Oven-dry-method. No rising moisture according to ASTM (Polyethylene-sheet). Pot Life Temperature | Pot-life | Open time | +15 °C | ~3 hours | ~6 hours | +23 °C | - | ~4 hours | +40 °C | ~60 minutes | ~90 minutes |
The pot-life begins when Parts A+B are mixed. It is shorter at high temperatures and longer at low temperatures. The greater the quantity mixed, the shorter the pot-life. To obtain longer workability at high temperatures, the mixed adhesive may be divided into smaller quantities. Another method is to chill Parts A+B before mixing (although not below +5 °C). |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.