| Sikadur-330 is a 2-component, thixotropic, epoxy based impregnating resin and adhesive. - Easily mixed and applied by trowel and impregnation roller.
- Manufactured for manual saturation methods.
- Excellent application behaviour to vertical and overhead surfaces.
- Good adhesion to many substrates.
- High mechanical properties.
- No separate primer required.
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Usage Sikadur-330 is used as: - Impregnation resin for SikaWrap fabric reinforcement for the dry application method.
- Primer resin for the wet application system.
- Structural adhesive for bonding Sika CarboDur plates into slits.
Advantages - Easily mixed and applied by trowel and impregnation roller.
- Manufactured for manual saturation methods.
- Excellent application behaviour to vertical and overhead surfaces.
- Good adhesion to many substrates.
- High mechanical properties.
- No separate primer required.
Packaging | 5 kg (A+B) | Pre-batched unit |
Colour Component A: white paste
Component B: grey paste
Components A + B mixed: light grey paste |
Technical Information Flexural E-Modulus | ~ 3 800 N/mm2 (7 days at +23 °C) | (DIN EN 1465) |
Tensile Strength | ~ 30 N/mm2 (7 days at +23°C) | (ISO 527) |
Tensile adhesion strength | Concrete fracture (> 4 N/mm2) on sandblasted substrate | (EN ISO 4624) |
Coefficient of Thermal Expansion | 4.5 × 10−5 1/K (Temperature range −10 °C to +40 °C) | (EN 1770) |
Service Temperature –40 °C to +45 °C
Glass transition temperature Curing time | Curing temperature | TG | 30 days | +30 °C | +58 °C |
Heat deflection temperature Curing time | Curing temperature | HDT | | 7 days | +10 °C | +36 °C | | 7 days | +23 °C | +47 °C | | 7 days | +35 °C | +53 °C |
Resistant to continuous exposure up to +45 °C.
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Application Information Mixing Ratio Component A : Component B = 4 : 1 by weight
When using bulk material, the exact mixing ratio must be safeguarded by accurately weighing and dosing each component. Ambient Air Temperature +10 °C min. / +35 °C max. Dew Point Beware of condensation.
Substrate temperature during application must be at least 3 °C above dew point. Substrate Temperature +10 °C min. / +35 °C max. Substrate Moisture Content < 4 % pbw Pot Life | Temperature | Pot-life | Open time | | +10 °C | ~90 minutes (5 kg) | ~90 minutes | | +23 °C | ~60 minutes (5 kg) | ~60 minutes | | +35 °C | ~30 minutes (5 kg) | ~30 minutes |
The pot-life begins when the resin and hardener are mixed. It is shorter at high temperatures and longer at low temperatures. The greater the quantity mixed, the shorter the pot-life. To obtain longer workability at high temperatures, the mixed adhesive may be divided into portions. Another method is to chill components A+B before mixing them (although not below +5 °C). |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.
