Solvent free elastic adhesive for wood floor bonding SikaBond MS Wood Floor is a high specification product, specifically designed for fixing all types of wooden floors directly onto all common substrates, eliminating the need for battens. Sikabond MS Wood Floor is based on the latest developments in hybrid polymer technology. - 1-component, ready to use.
- 100% solvent and water free, odourless.
- Will not cause warpage or curl of wood blocks or planks.
- Excellent workability
- Elastic, footfall sound-dampening.
- Suitable for all common types of wood floors.
- Reduces stress on the substrate and also reduces stress transfer between the wood floor and the substrate.
- Suitable for use with under floor heating.
- Can be sanded.
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Usage - Will bond engineered and solid wood flooring directly to all common subfloors inc. concrete, wood, metal, ceramic tiles, composite boards and most natural stone floors.
- Elastic Bonding of skirting boards / baseboards and door thresholds etc.
Advantages - 1-component, ready to use.
- 100% solvent and water free, odourless.
- Will not cause warpage or curl of wood blocks or planks.
- Excellent workability
- Elastic, footfall sound-dampening.
- Suitable for all common types of wood floors.
- Reduces stress on the substrate and also reduces stress transfer between the wood floor and the substrate.
- Suitable for use with under floor heating.
- Can be sanded.
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Technical Information Shear Strength >1.0 N/mm2 after 1 day and >2.0 N/mm2 after 1 week
Service Temperature -40°C to +80°C
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Application Information Sag Flow Consistency: spreads easily, trowel marks stable Ambient Air Temperature Ambient temperature shall be between +15°C and +35°C. Relative Air Humidity Between 40% and 70% Substrate Temperature During laying and until SikaBond MS Wood Floor has fully cured the substrate and ambient temperatures must be > +15°C and when used with under floor heating ~+20°C. Substrate Moisture Content Permissible substrate moisture content :
- 2.5% Carbide Method (CM) for cement screed (ca. 4% Tramex / Gravimetric weight percent)
- 0.5% CM for anhydrite screed
- 3 - 12% CM for magnesite flooring (dependent on the proportion of organic
material)
Permissible substrate moisture content for use with under floor heating:
- 1.8% CM for cement screed (ca. 3% Tramex / Gravimetric weight percent)
- 0.3% CM for anhydrite screed
- 3 - 12% CM for magnesite flooring (depending on the proportion of organic material). Curing Rate 1.0-2.0 mm / 24h (+23°C / 50% r. h.) The floor can be walked on / sanded 12 hrs to 24 hours after installation Skin Time / Laying Time ~ 40 minutes (+23°C / 50% r. h.) |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.
