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Sikadur-300, Epoxy Laminating Resin for Sikawrap Reinforcement Fabrics, Exterior, 20 Kg

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SIKA

Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.

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Epoxy impregnating / laminating resin for SikaWrap structural strengthening fabrics

Sikadur-300 is a 2-part, epoxy based impregnating / laminating resin for SikaWrap structural strengthening fabrics.

  • Easy to mix.
  • Application by impregnation roller.
  • Formulated for manual or mechanical saturation methods.
  • Good adhesion to many substrates.
  • High mechanical properties.
  • Extra long pot-life.
Usage
  • As an impregnating / laminating resin for the SikaWrap fabric reinforcement wet application method.
  • As a substrate primer for the wet application method.
 
Advantages
  • Easy to mix.
  • Application by impregnation roller.
  • Formulated for manual or mechanical saturation methods.
  • Good adhesion to many substrates.
  • High mechanical properties.
  • Extra long pot-life.
Packaging

Part A

22,305 kg pre-batched unit

Part B

7,695 kg pre-batched unit

Bulk containersRefer to current price list

Refer to current price list for packaging variations

Colour

Part A

~amber liquid

Part B

~pale yellow liquid

Parts A + B mixed

~light-yellow liquid

Technical Information
Flexural E-Modulus

~2800 N/mm2 (7 days at +23 °C)(DIN EN 1465)

Tensile Strength

~45 N/mm2 (7 days at +23 °C)(ISO 527)

Tensile adhesion strength

Concrete fracture (> 4 N/mm2) on sandblasted substrate

(EN ISO 4624)

Coefficient of Thermal Expansion

~6,0 × 10−5 (±0,2 × 10–5) 1/K

(EN 1770)

(linear expansion between -20 °C and +40 °C)

Service Temperature

–40 °C to +45 °C

Glass transition temperature

Curing time

Curing temperature

TG

30 days

+30 °C

+53 °C

Heat deflection temperature

Curing time

Curing temperature

HDT

7 days+15 °C+43 °C
7 days+23 °C+49 °C
3 days+40 °C+60 °C
7 days+40 °C+66 °C

 Resistant to continuous exposure +45 °C.

Application Information
Mixing Ratio

Part A : Part B = 100 : 34,5 by weight

Ambient Air Temperature

+15 °C min. / +40 °C max.

Dew Point

Beware of condensation.
The substrate and uncured applied resin must be at least +3 °C above dew point to reduce the risk of condensation or blooming on the resin surface.

Substrate Temperature

+15 °C min. / +40 °C max.

 
Substrate Moisture Content

≤ 4 % parts by weight

The following test methods can be used: Sika-Tramex meter,
CM-measurement or Oven-dry-method. No rising moisture according to ASTM (Polyethylene-sheet).

Pot Life

Temperature

Pot-life

Open time

+15 °C

~3 hours~6 hours

+23 °C

-~4 hours
+40 °C~60 minutes~90 minutes

The pot-life begins when Parts A+B are mixed. It is shorter at high temperatures and longer at low temperatures. The greater the quantity mixed, the shorter the pot-life. To obtain longer workability at high temperatures, the mixed adhesive may be divided into smaller quantities. Another method is to chill Parts A+B before mixing (although not below +5 °C).