Multipurpose adhesive for elastic bonding SikaBond AT Universal is a 1-component, solvent-free multipurpose adhesive with very good workability. - Silicone-free
- Non-corrosive
- Very good workability
- Short cut off string
- Good initial tack and fast curing
- Over-paintable
- High adhesive strength without priming
- Good weathering and water resistance
- Very good adhesion on non-porous and porous substrates
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Usage SikaBond AT Universal is designed for internal and external bonding of cable channels, acoustic tiles, and door sills, lightweight construction materials, bonding of roof and wall coverings and cover plates. Advantages - Silicone-free
- Non-corrosive
- Very good workability
- Short cut off string
- Good initial tack and fast curing
- Over-paintable
- High adhesive strength without priming
- Good weathering and water resistance
- Very good adhesion on non-porous and porous substrates
Packaging 300 ml cartridge, 12 cartridges per box 600 ml foil pack, 20 foil packs per box |
Technical Information Shore A Hardness ~33 (after 28 days) | (ISO 868) |
Secant Tensile Modulus ~0.60 N/mm² at 100% elongation (after 28 days) (23°C) | (ISO 8339) |
Elastic Recovery ~70% (after 28 days) | (ISO 7389) |
Lap Shear Strength ~1.0 N/mm2 (1 mm adhesive thickness) | (EN 1465) |
Tear Propagation Resistance Chemical Resistance SikaBond AT Universal is resistant to water, seawater, diluted alkalis, cement slurry and water dispersed detergent. SikaBond AT Universal is not resistant to alcohols, organic acids, concentrated alkalis and concentrated acids, chlorinated and aromatic hydro-carbons. SikaBond AT Universal is not or is only temporarily resistant to concentrated mineral acids, organic solvents (kelones, esters, aromatics) and alcohol, lacquer and paint thinners, organic acids and caustic solutions or solvents. For detailed information please contact Sika Technical Service. Service Temperature −40°C min./+80°C max. |
Application Information Sag Flow 0mm (20mm profile, 23°C) | (ISO 7390) | Ambient Air Temperature +5°C min./+40°C max. Relative Air Humidity 30% min./90% max. Substrate Temperature +5°C min./+40°C max. min. 3°C above dew point temperature Curing Rate ~3mm/24 hours (23°C/50% r.h.) | (CQP 049-2) | Skin Time ~35 minutes (23°C/50% r.h.) | (CQP 019-1) | |
The above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.