SikaBond AT Universal, Elastic Multipurpose Bonding Adhesive, Interior & Exterior, White, 300 mL
SIKA
Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.
Read more| Multipurpose adhesive for elastic bonding SikaBond AT Universal is a 1-component, solvent-free multipurpose adhesive with very good workability.
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UsageSikaBond AT Universal is designed for internal and external bonding of cable channels, acoustic tiles, and door sills, lightweight construction materials, bonding of roof and wall coverings and cover plates.Advantages
Packaging300 ml cartridge, 12 cartridges per box 600 ml foil pack, 20 foil packs per box ColourWhite, dark-grey | ||||||||||||||
Technical Information Shore A Hardness ~33 (after 28 days) (ISO 868) Tensile Strength ~1.5 N/mm2 (ISO 37) Secant Tensile Modulus ~0.60 N/mm² at 100% elongation (after 28 days) (23°C) (ISO 8339) Elastic Recovery ~70% (after 28 days) (ISO 7389) Lap Shear Strength ~1.0 N/mm2 (1 mm adhesive thickness) Tear Propagation Resistance ~5.0 N/mm (ISO 34) Movement Capability ± 20 % (ISO 9047) Chemical Resistance SikaBond AT Universal is resistant to water, seawater, diluted alkalis, cement slurry and water dispersed detergent. SikaBond AT Universal is not or is only temporarily resistant to concentrated mineral acids, organic solvents (kelones, esters, aromatics) and alcohol, lacquer and paint thinners, organic acids and caustic solutions or solvents. For detailed information please contact Sika Technical Service. Service Temperature −40°C min./+80°C max. | ||||||||||||||
Application Information Sag Flow
Ambient Air Temperature +5°C min./+40°C max. Relative Air Humidity 30% min./90% max. Substrate Temperature +5°C min./+40°C max. min. 3°C above dew point temperature Curing Rate
Skin Time
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