Sikaflex-554, STP Assembly Bonding Adhesive Accelerated, Interior & Exterior
SIKA
Sika is a global leader in specialty chemicals for the construction and industrial sectors. The company develops and supplies innovative products and systems for bonding, sealing, damping, reinforcing, and protecting structures. With a strong focus on sustainability and performance, Sika serves a wide range of applications including concrete production, waterproofing, roofing, flooring, and structural strengthening.
Read more| STP assembly bonding adhesive with acceleration option Sikaflex-554 is an elastic 1-component Silane Terminated Polymer (STP) adhesive system especially designed for bonding large components in industrial assembly. It bonds well to a wide range of substrates with minimal pre-treatment.
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PRODUCT BENEFITS
UsageSikaflex-554 is suitable for joints that will be subjected to dynamic stresses. Suitable substrate materials are metals, particularly aluminum, metal primers, paint coatings, sheet steel, ceramic materials and certain plastics. It bonds well to a wide range of substrates with minimal pre-treatment. Seek manufacturer’s advice and perform tests on original substrates before using Sikaflex-554 on materials prone to stress cracking.Sikaflex-554 is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility. Packaging
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Typical Product Data
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Technical Information CURE MECHANISM Sikaflex-554 cures by reaction with atmospheric moisture. At low temperatures the water content of the air is generally lower and the curing reaction proceeds somewhat slower (see diagram 1). Diagram 1: Curing speed Sikaflex-554 CHEMICAL RESISTANCE Sikaflex-554 is generally resistant to fresh water, seawater, diluted acids and diluted caustic solutions; temporarily resistant to fuels, mineral oils, vegetable and animal fats and oils; not resistant to organic acids, glycolic alcohol, concentrated mineral acids and caustic solutions or solvents. | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Application Information Surface Preparation Surfaces must be clean, dry and free from grease, oil, dust and contaminants. Application Sikaflex-554 can be processed between 5 °C and 40 °C (climate and product) but changes in reactivity and application properties have to be considered. The optimum temperature for substrate and sealant is between 15 °C and 25 °C. To ensure a uniform thickness of the bondline it is recommend to apply the adhesive in form of a triangular bead (see figure 1).
Tooling and finishing Tooling and finishing must be carried out within the skin time of the product. It is recommended using Sika Tooling Agent N. Other finishing agents must be tested for suitability and compatibility prior the use. Removal Uncured Sikaflex-554 may be removed from tools and equipment with Sika Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically. Do not use solvents on skin. |
Figure 1: Recommended bead configurationThe above design is only a sample of the options available, for reference purposes only. Our policy of continuous improvement may result in a change of specifications without notice. If any discrepencies might be between the data sheet values and standards, we reserve the rights to make technical changes. Our company will not be held responsible, as all or any of pictures, drawings, weights and dimensions details or other elements in this document are only indicative and must not be considered contractual. Contact our sales team for other specifications or custom made products.
Contact our sales team for other specifications or custom made products.| STP assembly bonding adhesive with acceleration option Sikaflex-554 is an elastic 1-component Silane Terminated Polymer (STP) adhesive system especially designed for bonding large components in industrial assembly. It bonds well to a wide range of substrates with minimal pre-treatment.
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PRODUCT BENEFITS
UsageSikaflex-554 is suitable for joints that will be subjected to dynamic stresses. Suitable substrate materials are metals, particularly aluminum, metal primers, paint coatings, sheet steel, ceramic materials and certain plastics. It bonds well to a wide range of substrates with minimal pre-treatment. Seek manufacturer’s advice and perform tests on original substrates before using Sikaflex-554 on materials prone to stress cracking.Sikaflex-554 is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility. Packaging
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Typical Product Data
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Technical Information CURE MECHANISM Sikaflex-554 cures by reaction with atmospheric moisture. At low temperatures the water content of the air is generally lower and the curing reaction proceeds somewhat slower (see diagram 1). Diagram 1: Curing speed Sikaflex-554 CHEMICAL RESISTANCE Sikaflex-554 is generally resistant to fresh water, seawater, diluted acids and diluted caustic solutions; temporarily resistant to fuels, mineral oils, vegetable and animal fats and oils; not resistant to organic acids, glycolic alcohol, concentrated mineral acids and caustic solutions or solvents. | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Application Information Surface Preparation Surfaces must be clean, dry and free from grease, oil, dust and contaminants. Application Sikaflex-554 can be processed between 5 °C and 40 °C (climate and product) but changes in reactivity and application properties have to be considered. The optimum temperature for substrate and sealant is between 15 °C and 25 °C. To ensure a uniform thickness of the bondline it is recommend to apply the adhesive in form of a triangular bead (see figure 1).
Tooling and finishing Tooling and finishing must be carried out within the skin time of the product. It is recommended using Sika Tooling Agent N. Other finishing agents must be tested for suitability and compatibility prior the use. Removal Uncured Sikaflex-554 may be removed from tools and equipment with Sika Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically. Do not use solvents on skin. |